Rockchip RK3568 []

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===== Rockchip RK3568 =====
==== Overview ====
**RK3568** [[https://www.rock-chips.com/a/en/products/RK35_Series/2021/0113/1276.html|page]]:
  * Quad-core Cortex-A55 up to 2.0GHz
  * Mali-G52 GPU
  * LPDDR4/LPDDR4X/DDR4/DDR3/DDR3L/LPDDR3, ECC
  * 4KP60 H.265/H.264/VP9 video decoder
  * 1080P60 H.264/H.265 video encoder
  * 8M ISP with HDR
  * Dual dislplay, LVDS/MIPI-DSI/RGB/eDp/RGB/HDMI2.0/T-CON
  * 1x8ch I2S/TDM, 1x8ch PDM, 2x2ch I2S
  * USB3.0 x2/SATA3.0 x3/PCIE2.1/QSGMII
  * PCIE3.0 1x2Lanes/2x1Lane


==== Struct ====
{{wiki:cmp:proc:rockchip:rk3568:pasted:20220215-194234.png}}


==== Thermal ====
  * Commercial device **RK3568**:
    * Absolute Ratings:
      * Storage Temperature - Tstg -40...125 ℃
      * Max Conjunction Temperature - Tj 125 ℃
    * Recommended Operating Condition:
      * Ambient Operating Temperature T<sub>A</sub> 0...80 ℃
    * Package Thermal Characteristics:
      * The testing PCB is 4 layers, 114.3mmx101.6mm, 1.6mm thickness, Ambient temperature is 25℃.
      * Junction-to-ambient thermal resistance 𝜽𝑱𝑨 15.925 (℃/𝑾)
      * Junction-to-board thermal resistance 𝜽𝑱𝑩 10.813 (℃/𝑾)
      * Junction-to-case thermal resistance 𝜽𝑱𝑪 0.487 (℃/𝑾)
  * Industrial device **RK3568J**:
    * Absolute Ratings:
      * Storage Temperature - Tstg -40...125 ℃
      * Max Conjunction Temperature - Tj 125 ℃
    * Recommended Operating Condition:
      * Ambient Operating Temperature T<sub>A</sub> -40...85 ℃
    * Package Thermal Characteristics:
      * The testing PCB is 4 layers, 114.3mmx101.6mm, 1.6mm thickness, Ambient temperature is 25℃.
      * Junction-to-ambient thermal resistance 𝜽𝑱𝑨 15.5 (℃/𝑾)
      * Junction-to-board thermal resistance 𝜽𝑱𝑩 11.3 (℃/𝑾)
      * Junction-to-case thermal resistance 𝜽𝑱𝑪 2.43 (℃/𝑾)




==== Docs ====
^ link                                                                                                                                ^ ext  ^ description                           ^ version ^ date    ^ lang ^
| [[http://doc.inmys.ru/open?hash=e1ef672d4045d1cb27159a7f16d99d9d|RK3568_Methods for Processing Unused Pins_V10_20201218_CN.xlsx]] | xlsx | Что делать с неиспользуемыми выводами | V1.0 | 2020.12.18 | CN |
| [[http://doc.inmys.ru/open?hash=831066befa1f753fd56ff7628b0b8769|RK3568_Package_PinLength_V1.0_20200917_EN.xlsx]] | xlsx | Длины проводников в корпусе [[wiki:cmp:proc:rockchip:rk3568:package_pin_length_v1|table]] | V1.0 | 2020.09.17 | EN |
| [[http://doc.inmys.ru/open?hash=abc2afc26e26b63d62f9480e1c9a2a8f|RK3568_PinOut_V1.0_20201230_EN.xlsx]] | xlsx | RK3568 PinOut | V1.0 | 2020.12.30 | EN |
| [[http://doc.inmys.ru/open?hash=b622262af1eef35e4e48adfc794e9449|RK3568_PinOut_V1.1_20210202.xlsx]] | xlsx | RK3568 Pinout | V1.1 | 2021.02.02 | |
| [[http://doc.inmys.ru/open?hash=ed74e4fddf60ddebb0e0643fedd5562b|Rockchip RK3568 Datasheet V1.0-20201210.pdf]] | pdf | RK3568 Datasheet | V1.0 | 2020.12.10 | |
| [[http://doc.inmys.ru/open?hash=8e535bb6da8543b126a1358af8451c88|Rockchip RK3568 Datasheet V1.2-20210601.pdf]] | pdf | RK3568 Datasheet | V1.2 | 2021.06.01 | |
| [[http://doc.inmys.ru/open?hash=5548329cf3c3cf9d3417d063f2cb9ae9|Rockchip RK3568 TRM Part1 V1.1-20210301.pdf]] | pdf | RK3568 TRM Part 1 | V1.1 | 2021.03.01 | |
| [[http://doc.inmys.ru/open?hash=2d8d4aeee8722c8967fdd55316804954|Rockchip RK3568 TRM Part2 V1.1-20210301.pdf]] | pdf | RK3568 TRM Part 2 | V1.1 | 2021.03.01 | |
| [[http://doc.inmys.ru/open?hash=1ca82f21884f236073e33a0554287810|RK3568_AIoT_REF_SCH_V10_20210204.DSN]] | DSN | Схема ref design AIoT (ORCAD) | V1.0 | 2021.02.04 | |
| [[http://doc.inmys.ru/open?hash=054cea42efc227046f44ea17d2fa8bca|RK3568_AIoT_REF_SCH_V10_20210204.pdf]] | pdf | Схема ref design AIoT (pdf) | V1.0 | 2021.02.04 | |
| [[http://doc.inmys.ru/open?hash=26b42be2bb6d33b5c927b7ce393dfb8b|RK3568_AIOT_REF_SCH_V10_20210204-162.DSN]] | DSN | Схема ref design AIoT (ORCAD) - Непонятно чем отличающаяся | V1.0 | 2021.02.04 | |


==== PCB routing ====
RockChip ref design: 0.035u\0.082 prepreg Dk4.5

^ impedance ^ w       ^    s ^ Impedance ^ Comment ^ 
|       SE? | 3.5 mil |      |   ??? Ohm | BGA breakout |
|       SE? |   4 mil |      |   ??? Ohm | LPDDR4, RGMII, EMMC |
|       SE? |   6 mil |      |   ??? Ohm | XTAL |
|  DIFF100? | 3.8 mil | 6mil |   ??? Ohm | LPDDR4, CSI, DSI, eDP, MDI, HDMI|
|   DIFF85? | 4.7 mil | 4mil |   ??? Ohm | PCIe 3.0 |
|   DIFF90? |   4 mil | 4mil |   ??? Ohm | SATA, USB3 SS, USB2 |

0201 - 0.25x0.3x0.3


==== Boot ====
Support system boot from the following device:
  * Serial Nor Flash, 1bit or 4bits data width(device layout in FSPI IO)
  * Serial Nand Flash, 1bit data width(device layout in FSPI IO)
  * Asynchronous Flash Interface, 8bits data width
  * eMMC Interface, 8bits data width
  * SDMMC Card, 4bits data width
  * Support system code download by USB OTG

{{ wiki:cmp:proc:rockchip:rk3568:pasted:20220321-160515.png?480 }}

https://roc-rk3328-cc.readthedocs.io/en/latest/flash_emmc.html

https://wiki.t-firefly.com/en/ROC-RK3568-PC/01-bootmode.html

Есть 2 режима для записи eMMC - RockChip USB mode и Maskrom USB mode:
  * RockChip USB mode
    * работает, если работает bootloader и SARADC0 == 0 ????
  * Maskrom USB mode.
    * работает, если ничего не работает, и  D0 (или Clock) bootmedia закорочен на землю

{{wiki:cmp:proc:rockchip:rk3568:pasted:20220321-161750.png}}

{{wiki:cmp:proc:rockchip:rk3568:pasted:20220321-161802.png}}

{{wiki:cmp:proc:rockchip:rk3568:pasted:20220321-162145.png}}

http://opensource.rock-chips.com/wiki_Boot_option#Boot_flow
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