Rockchip RK3568

Overview

RK3568 page:

Quad-core Cortex-A55 up to 2.0GHz

Mali-G52 GPU

LPDDR4/LPDDR4X/DDR4/DDR3/DDR3L/LPDDR3, ECC

4KP60 H.265/H.264/VP9 video decoder

1080P60 H.264/H.265 video encoder

8M ISP with HDR

Dual dislplay, LVDS/MIPI-DSI/RGB/eDp/RGB/HDMI2.0/T-CON

1x8ch I2S/TDM, 1x8ch PDM, 2x2ch I2S

USB3.0 x2/SATA3.0 x3/PCIE2.1/QSGMII

PCIE3.0 1x2Lanes/2x1Lane

Struct

Thermal

Commercial device RK3568:

Absolute Ratings:

Storage Temperature - Tstg -40…125 ℃

Max Conjunction Temperature - Tj 125 ℃

Recommended Operating Condition:

Ambient Operating Temperature TA 0…80 ℃

Package Thermal Characteristics:

The testing PCB is 4 layers, 114.3mmx101.6mm, 1.6mm thickness, Ambient temperature is 25℃.

Junction-to-ambient thermal resistance 𝜽𝑱𝑨 15.925 (℃/𝑾)

Junction-to-board thermal resistance 𝜽𝑱𝑩 10.813 (℃/𝑾)

Junction-to-case thermal resistance 𝜽𝑱𝑪 0.487 (℃/𝑾)

Industrial device RK3568J:

Absolute Ratings:

Storage Temperature - Tstg -40…125 ℃

Max Conjunction Temperature - Tj 125 ℃

Recommended Operating Condition:

Ambient Operating Temperature TA -40…85 ℃

Package Thermal Characteristics:

The testing PCB is 4 layers, 114.3mmx101.6mm, 1.6mm thickness, Ambient temperature is 25℃.

Junction-to-ambient thermal resistance 𝜽𝑱𝑨 15.5 (℃/𝑾)

Junction-to-board thermal resistance 𝜽𝑱𝑩 11.3 (℃/𝑾)

Junction-to-case thermal resistance 𝜽𝑱𝑪 2.43 (℃/𝑾)

Docs

link	ext	description	version	date	lang
RK3568_Methods for Processing Unused Pins_V10_20201218_CN.xlsx	xlsx	Что делать с неиспользуемыми выводами	V1.0	2020.12.18	CN
RK3568_Package_PinLength_V1.0_20200917_EN.xlsx	xlsx	Длины проводников в корпусе table	V1.0	2020.09.17	EN
RK3568_PinOut_V1.0_20201230_EN.xlsx	xlsx	RK3568 PinOut	V1.0	2020.12.30	EN
RK3568_PinOut_V1.1_20210202.xlsx	xlsx	RK3568 Pinout	V1.1	2021.02.02
Rockchip RK3568 Datasheet V1.0-20201210.pdf	pdf	RK3568 Datasheet	V1.0	2020.12.10
Rockchip RK3568 Datasheet V1.2-20210601.pdf	pdf	RK3568 Datasheet	V1.2	2021.06.01
Rockchip RK3568 TRM Part1 V1.1-20210301.pdf	pdf	RK3568 TRM Part 1	V1.1	2021.03.01
Rockchip RK3568 TRM Part2 V1.1-20210301.pdf	pdf	RK3568 TRM Part 2	V1.1	2021.03.01
RK3568_AIoT_REF_SCH_V10_20210204.DSN	DSN	Схема ref design AIoT (ORCAD)	V1.0	2021.02.04
RK3568_AIoT_REF_SCH_V10_20210204.pdf	pdf	Схема ref design AIoT (pdf)	V1.0	2021.02.04
RK3568_AIOT_REF_SCH_V10_20210204-162.DSN	DSN	Схема ref design AIoT (ORCAD) - Непонятно чем отличающаяся	V1.0	2021.02.04

PCB routing

RockChip ref design: 0.035u\0.082 prepreg Dk4.5

impedance	w	s	Impedance	Comment
SE?	3.5 mil	??? Ohm	BGA breakout
SE?	4 mil	??? Ohm	LPDDR4, RGMII, EMMC
SE?	6 mil	??? Ohm	XTAL
DIFF100?	3.8 mil	6mil	??? Ohm	LPDDR4, CSI, DSI, eDP, MDI, HDMI
DIFF85?	4.7 mil	4mil	??? Ohm	PCIe 3.0
DIFF90?	4 mil	4mil	??? Ohm	SATA, USB3 SS, USB2

0201 - 0.25×0.3×0.3

Boot

Support system boot from the following device:

Serial Nor Flash, 1bit or 4bits data width(device layout in FSPI IO)

Serial Nand Flash, 1bit data width(device layout in FSPI IO)

Asynchronous Flash Interface, 8bits data width

eMMC Interface, 8bits data width

SDMMC Card, 4bits data width

Support system code download by USB OTG

https://roc-rk3328-cc.readthedocs.io/en/latest/flash_emmc.html

https://wiki.t-firefly.com/en/ROC-RK3568-PC/01-bootmode.html

Есть 2 режима для записи eMMC - RockChip USB mode и Maskrom USB mode:

RockChip USB mode

работает, если работает bootloader и SARADC0 == 0 ????

Maskrom USB mode.

работает, если ничего не работает, и D0 (или Clock) bootmedia закорочен на землю

http://opensource.rock-chips.com/wiki_Boot_option#Boot_flow